Active soldering of ZnS–SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal

Resource

Journal of Materials Processing Technology 202 (1-3): 22-26

Journal

Journal of Materials Processing Technology

Journal Issue

202

Pages

22-26

Date Issued

2008

Date

2008

Author(s)

Chang, S.Y.

Chuang, T.H.

Tsao, L.C.

Yang, C.L.

Yang, Z.S.

URI

Type

journal article

File(s)

Name

108.pdf

Size

1.27 MB

Format

Adobe PDF

Checksum

(MD5):7f6ae2596b9f9c18b7bcd20aa9971e00