Simulation and Analysis of Conducted EMI for a Commercial High-density DC/DC Power Module
Date Issued
2005
Date
2005
Author(s)
Liu, Pei-Hsin
DOI
en-US
Abstract
Electromagnetic Interference (EMI) has always been a major concern for power electronic circuit design engineers. Despite the progress made in recent years, there is still “black magic” associate with fixing the EMI problems in the industry. Attempts have been made in the past few years to use simulation tools to predict conducted EMI behavior in power electronic circuits and results were reported in research articles. However, the results reported in these articles were obtained in research environment. Doubts were expressed if such results can still be meaningful in a commercial environment. To address such an issue, efforts were spent to investigate the conducted EMI of a commercial 40-Watt 320-KHz 15-volt output high-density DC/DC power module using computer simulation tools.
In the thesis, methodology of computer simulation of EMI behavior is outlined. Parasitic elements of importance, including those of the power components, the printed circuit board, and the assembly package, were included in the simulation. IsSPICE was used for time-domain simulation and Fast-Fourier Transform function was used to converter the simulation results into frequency-domain EMI data.
It is concluded from the investigation that simulation complexity can be reduced to a practical level without losing the accuracy for frequency range below 10MHz. Although the accuracy is limited, analysis of the results already provides useful information and practical guidance for EMI reduction for the product. For frequency beyond 10MHz, the simulation results deviate significantly from the experimental results. This is not unexpected. Package proximity effects, which are still not fully understood, were not incorporated in the simulation. Further works along this line is needed in the future.
Subjects
電磁干擾
直流/直流電源模塊
分析
EMI
DC/DC power module
analysis
Type
thesis
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