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  4. LTCC-based Dual-Polarized AiP Module by Multilayered Cross-Dipole Antennas for 5G Mobile Terminal Applications at 28 GHz Band
 
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LTCC-based Dual-Polarized AiP Module by Multilayered Cross-Dipole Antennas for 5G Mobile Terminal Applications at 28 GHz Band

Journal
IEEE Transactions on Components, Packaging and Manufacturing Technology
Date Issued
2023-01-01
Author(s)
HSI-TSENG CHOU  
Chou, Sheng Ju
Deng, Joseph D.S.
Yan, Zhi Da
DOI
10.1109/TCPMT.2023.3307616
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/636092
URL
https://api.elsevier.com/content/abstract/scopus_id/85168723273
Abstract
An antenna-in-package (AiP) of 4 × 4 elements with dual-polarized radiations for high-power radiation at a 28 GHz band was designed and fabricated by low-temperature co-fired ceramic (LTCC) for 5G applications. The design starts with selecting cross-dipole elements to ensure good polarization purity. The l/4 separation from a ground plane is achieved by considering a proper combination of multilayered substrates’ thicknesses and their dielectric constant, where the feedings are probed by coaxial-type vias from the bottom. The dipole arms’ shapes are optimally tuned to achieve broadband reflection coefficients. This AiP has the advantage of dual-polarizations along +/-45 degrees to avoid harmful interferences from metal-supporting structures, reasonable inter port isolations, and low cross-polarization levels. The AiP has a compact profile of 28x28 mm2. The inter-port isolation between the polarization excitation ports is larger than 33dB from HFSS full-wave simulations. The elements’ bandwidth is larger than 6 GHz from the full-wave simulation and broader than 4 GHz from measurements over the antenna prototype. The array has a bandwidth larger than 6 GHz from measurement with a maximum gain of 16.6dBi and a sidelobe level of 13.3 dB, validating the design concept.
Subjects
Antenna measurements | Antenna-in-package | Antennas | Bandwidth | cross-dipole | Dielectric substrates | dual-polarization | low-temperature co-fired ceramics | Metals | multilayer substrates | Radio frequency | Substrates
Type
journal article

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