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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Oxidation behavior of copper at a temperature below 300 °c and the methodology for passivation
Details
Oxidation behavior of copper at a temperature below 300 °c and the methodology for passivation
Journal
Materials Research
Journal Volume
19
Journal Issue
1
Pages
51-56
Date Issued
2016
Author(s)
Lee, S.-K.
Hsu, H.-C.
Tuan, W.-H.
WEI-HSING TUAN
DOI
10.1590/1980-5373-MR-2015-0139
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/492161
URL
https://www.scopus.com/inward/record.uri?eid=2-s2.0-84963611531&doi=10.1590%2f1980-5373-MR-2015-0139&partnerID=40&md5=d1a1106174334b8aa25a03c26c7f48ed
SDGs
[SDGs]SDG6
Type
journal article