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College of Electrical Engineering and Computer Science / 電機資訊學院
Electrical Engineering / 電機工程學系
Chip-package-board co-design - A DDR3 system design example from circuit designers' perspective
Details
Chip-package-board co-design - A DDR3 system design example from circuit designers' perspective
Journal
2008 Electrical Design of Advanced Packaging and Systems Symposium, IEEE EDAPS 2008
Pages
27-30
Date Issued
2008
Author(s)
Lin, Y.-H.
Chou, J.
Lu, Y.-C.
Wu, T.-L.
YI-CHANG LU
HSIN-SHU CHEN
TZONG-LIN WU
DOI
10.1109/EDAPS.2008.4735990
URI
http://www.scopus.com/inward/record.url?eid=2-s2.0-60649106966&partnerID=MN8TOARS
http://scholars.lib.ntu.edu.tw/handle/123456789/340735
Type
conference paper
