Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packages

Journal

Journal of Electronic Materials

Journal Volume

32

Journal Issue

3

Pages

195-200

Date Issued

2003

Author(s)

Chuang, T.H.

Chang, S.Y.

Tsao, L.C.

Weng, W.P.

Wu, H.M.

TUNG-HAN CHUANG

DOI

10.1007/s11664-003-0193-0

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/492026

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-0037349029&doi=10.1007%2fs11664-003-0193-0&partnerID=40&md5=eff1479138b6cb446b06989ff31b4572

Type

journal article