The study of microstructure evolution of tin grains due to electromigration by using synchrotron X-ray microdiffraction
Resource
TMS Letters,1(8),165-166.
Journal
TMS Letters
Journal Volume
1
Journal Issue
8
Pages
165-166
Date Issued
2004-09
Date
2004-09
Author(s)
Wu, A. T.
Tu, K. N.
Lloyd, J. R.
Tamura, N.
Valek, B. C.
Kao, and C. R.
Type
journal article