Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler

Resource

Journal of Materials Engineering and Performance 12 (4): 383-389

Journal

Journal of Materials Engineering and Performance

Journal Volume

12

Journal Issue

4

Pages

383-389

Date Issued

2003

Date

2003

Author(s)

Chang, S. Y.

Tsao, L. C.

Chiang, M. J.

Chuang, T. H.

Tung, C. N.

Pan, G. H.

URI

Type

journal article

File(s)

Name

83.pdf

Size

686.2 KB

Format

Adobe PDF

Checksum

(MD5):7338f1c2c5966a90f0d5b9587a9c244b