Effect of copper concentration on the solid-state reactions between tin-copper lead-free solders and nicke
Resource
Journal of Surface Mount Technology,15(4),40-45.
Journal
Journal of Surface Mount Technology
Journal Volume
15
Journal Issue
4
Pages
40-45
Date Issued
2002-10
Date
2002-10
Author(s)
Chen, W. T.
Tsai, R. Y.
Lin, Y. L.
Kao, and C. R.
Type
journal article