The Microstructural Evolution of Infrared Joining of TiAl Intermerallics Using Ti-15Cu-15Ni Foil
Resource
Chinese Journal of Materials Science 29: 134-139
Journal
Chinese Journal of Materials Science 29:
Pages
134-139
Date Issued
1997
Date
1997
Author(s)
Lee, S.J.
Wu, S.K.
Wang, J.Y.
Type
journal article