A Comparison Study on Collaboration Model of Engineering Chain in the Semiconductor Industry
Date Issued
2008
Date
2008
Author(s)
Hsu, Wen-Liang
Abstract
There are more and more collaboration between IC manufacture and IC design, especially in the deep sub-micron era. The engineering chain collaboration is more and more important. However, most of the passed reaches about engineering chain focused on IC manufacture and few of them focused on IC design.his study focuses on IC design related issues to explore the collaboration models in the engineering chain of semiconductor industry. There are three target engineering chains in this study: TSMC engineering chain, UMC engineering chain and Chartered-IBM engineering chain. Firstly, this study explores the inter-firm collaborations about the PDK, IP and IC design service within the above three engineering chains. The actual collaboration results of each engineering chain are presented, too. Secondly, this study compares the difference among these three engineering chains about PDK, IP and IC design service respectively. Finally, the lock-in, switching cost and versioning are discussed.his study finds that these three engineering chains have different strategies in PDK, IP and IC design service. The PDK of each engineering chain has different characteristics in both process technology node and process type. For hard/firm IP, there are three combinations of different types of major IP suppliers: foundry only, foundry plus design service companies, and EDA tool companies. The alliances for IC design service business of these three engineering chains are different, too. Overall, in the above fields, cooperation happens more often than competition within the same engineering chain; competition always happens among different engineering chains.
Subjects
engineering chain
collaboration
IC design service
Type
thesis
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