Study on Wear Mechanism of Diamond Dresser
Date Issued
2009
Date
2009
Author(s)
Cheng, Wei-Hsiang
Abstract
Chemical mechanical polishing (CMP) is the mostly used planarization process in the semiconductor industry today. Due to the dual actions of chemicals corrosion and abrasive abrasion in the slurry, CMP achieves the effect of global planarization on the thin film surface of wafers. The abrasive, debris and by-product generated in the process cause the pores of the pad surface glazing, which in turn renders the performance of transporting slurry to decrease. Accordingly, the removal rate (RR) and non-uniformity (NU) will be affected. The diamond dressers are used to remove the glazing layer of the pad surface. This action makes the ability of pad in transporting the slurry restored. The diamond dressers were worn by slurry and the glazing layer of the pad surface caused dressing rate decreased. The dresser lifetime was improved by changing the parameters of dresser on this study. This study was made to observe and discuss the wear mechanisms of the diamond dressers. First, the diamond dressers with different number of working diamonds were made and the effects of lifetime of dressers were explored. Then, it was observed that the number of working diamonds varies with different types of dressers. The dressing simulation was made to examine the lifetime and the surface condition of the ceramic dressers with different diamond shapes, sizes and pitches. It was found from experimental data that the diamonds with larger pitches、sharper shape and smaller size wore faster, and the pad surface roughness decreased as dressing rate decreased.
Subjects
Diamond Dresser
Lifetime
Dressing Rate
Surface Roughness
Type
thesis
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