Novel Method for in situ Monitoring of Thickness of Quartz during Wet Etching
Resource
Japanese Journal of Applied Physics 44 (10): 7662-7666
Journal
Japanese Journal of Applied Physics
Journal Volume
44
Journal Issue
10
Pages
7662-7666
Date Issued
2005
Date
2005
Author(s)
Lee, Chi-Yuan
Chen, Yung-Yu
Dai, Ching-Liang
Chen, Ping-Hei
Abstract
In this work, we present a novel method based on a plate wave sensor for the in situ monitoring of the thickness of quartz membranes during wet etching. Similarly to oscillators and resonators, some acoustic devices require the thickness of quartz membranes to be determined precisely. Precise control of the thickness of quartz membranes during wet etching is important, because the thickness strongly influences post processing and frequency control. Furthermore, the proposed plate wave sensor, allows the thickness of quartz membranes from a few (im to hundreds of μm to be monitored in situ, which depends on the periodicity of an interdigital transducer (IDT). In summary, the proposed method for measuring the thickness of quartz membranes in real time has a high accuracy, is simple to set up and can be mass-produced. Also described herein are the principles of the method used, the detailed process flow, the measurement set up and the simulation and experimental results. The theoretical and measured values differ by an error of less than 1 μm, implying a close correspondence. © 2005 The Japan Society of Applied Physics.
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