無鉛銲錫球格陣列構裝製程與可靠度分析─子計畫一: 無鉛銲錫球格陣列構裝接點之冷熱循環與動態疲勞分析(II)
Date Issued
2002
Date
2002
Author(s)
DOI
902216E002032
Abstract
Among the merits of ball grid array
(BGA) packages are high I/O density,
good electrical properties, fine heat
dissipation capability, low cost and high
yield rates. It is small wonder that BGA
has been gaining popularity in related
fields when capped with the
compatibility with surface mount
technology (SMT). Responding to the
lead-free trend in the electronic industry,
this project is devoted to the
manufacturing study and reliability
analysis of ball grid array packages by
adopting Pb-free solder balls in lieu of
traditional Pb-Sn solders. With respect to
the reliability analysis, temperature
cycling and dynamic fatigue testing are
scheduled in this subprogram. In the
second year of this project, the electrical
analyses have been involved in addition
to the dynamic fatigue test and thermal
cycling test, in order to shed more light
on viable data resources for the
applications. Through the electrical
analysis, the influences of intermetallic
growth, microstructure changes and
crack formation upon the electrical
properties of solder joints will also be
systematically investigated.
(BGA) packages are high I/O density,
good electrical properties, fine heat
dissipation capability, low cost and high
yield rates. It is small wonder that BGA
has been gaining popularity in related
fields when capped with the
compatibility with surface mount
technology (SMT). Responding to the
lead-free trend in the electronic industry,
this project is devoted to the
manufacturing study and reliability
analysis of ball grid array packages by
adopting Pb-free solder balls in lieu of
traditional Pb-Sn solders. With respect to
the reliability analysis, temperature
cycling and dynamic fatigue testing are
scheduled in this subprogram. In the
second year of this project, the electrical
analyses have been involved in addition
to the dynamic fatigue test and thermal
cycling test, in order to shed more light
on viable data resources for the
applications. Through the electrical
analysis, the influences of intermetallic
growth, microstructure changes and
crack formation upon the electrical
properties of solder joints will also be
systematically investigated.
Subjects
Pb-free solder
ball grid array package
temperature cycling test
dynamic fatigue test
electrical analysis
Publisher
臺北市:國立臺灣大學材料科學與工程學研究所
Type
report
File(s)![Thumbnail Image]()
Loading...
Name
902216E002032.pdf
Size
321.8 KB
Format
Adobe PDF
Checksum
(MD5):8046346c893a306f25156d6ea6d3b994