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College of Engineering / 工學院
Mechanical Engineering / 機械工程學系
Ribbed Package Geometry for Reducing Thermal Warpage and Wire Sweep during PBGA Encapsulation
Details
Ribbed Package Geometry for Reducing Thermal Warpage and Wire Sweep during PBGA Encapsulation
Resource
IEEE Transactions on Components and Packaging Technologies 23 (4): 700-706
Journal
IEEE Transactions on Components and Packaging Technologies
Journal Volume
23
Journal Issue
4
Pages
700-706
Date Issued
2000
Date
2000
Author(s)
Yang, S. Y.
Jiang, S. C.
Lu, W. S.
DOI
10.1109/6144.888856
URI
http://ntur.lib.ntu.edu.tw//handle/246246/85965
https://www.scopus.com/inward/record.uri?eid=2-s2.0-0034479718&doi=10.1109%2f6144.888856&partnerID=40&md5=050d2627f114717ccd5338020f427568
Type
journal article
File(s)
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Name
16.pdf
Size
170.74 KB
Format
Adobe PDF
Checksum
(MD5):67f9b39952bd5a0edff1347645747b23
