Devising a method to measure film adhesion through modeling
Journal
Applied Physics Letters
Journal Volume
81
Journal Issue
9
Pages
1615-1617
Date Issued
2002
Author(s)
Hsueh C.H.
Abstract
A method for measuring film adhesion is devised. It consists of a series of patterned film strips with different widths on a substrate, such that the driving force for each strip to debond increases as strip width increases when the system is subjected to residual and/or applied stresses. In this case, only those strips with sufficient driving force debond while the others remain attached to the substrate. Hence, qualitative comparison of the interface debond energy can be obtained by comparing the strip width below which debonding no longer occurs. By calculating the driving force for each strip to debond, the interface debond energy can be quantitatively determined. ? 2002 American Institute of Physics.
SDGs
Type
journal article