Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders
Resource
Journal of Materials Research,17(2),263-266.
Journal
Journal of Materials Research
Journal Volume
17
Journal Issue
2
Pages
263-266
Date Issued
2002-02
Date
2002-02
Author(s)
Chen, W. T.
Ho, C. E.
Kao, and C. R.
Type
journal article