Molecular dynamics study of copper trench filling in damascene process

Journal

Materials Science in Semiconductor Processing

Journal Volume

8

Journal Issue

5

Pages

587-601

Date Issued

2005

Author(s)

Hong, R.T.

Huang, M.J.

Yang, J.Y.

DOI

10.1016/j.mssp.2005.05.001

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/447925

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-27844478321&doi=10.1016%2fj.mssp.2005.05.001&partnerID=40&md5=6350fe94a6764b5a811417980d92dab0

Type

journal article