Thermal Modeling and Device Noise Properties of Three-Dimensional–SOI Technology

Resource

IEEE Transactions on Electron Devices, 56(4), 656-664

Journal

IEEE Transactions on Electron Devices

Journal Volume

56

Journal Issue

4

Pages

656-664

Date Issued

2009

Date

2009

Author(s)

Chen, Tze Wee

Chun, Jung Hoon

Navid, R.

Wang, Wei

Chen, Chang-Lee

Dutton, R.W.

URI

Type

journal article

File(s)

Name

02.pdf

Size

23.21 KB

Format

Adobe PDF

Checksum

(MD5):310544d0848403cf4eff966ad56a8400