Mixed-Size 3D Analytical Placement with Heterogeneous Technology Nodes
Part Of
Proceedings - Design Automation Conference
Start Page
1
End Page
6
ISBN (of the container)
Proceedings - Design Automation Conference
Date Issued
2024-06-23
Author(s)
Abstract
This paper proposes a mixed-size 3D analytical placement framework for face-to-face stacked integrated circuits fabricated with heterogeneous technology nodes and connected by hybrid bonding technology. The proposed framework efficiently partitions a given netlist into two dies and optimizes the positions of each macro, standard cell, and hybrid bonding terminal (HBT). A multi-technology objective function and a multi-technology density penalty calculation process are adopted to handle the heterogeneous-technology-node constraints during mixed-size 3D global placement. Furthermore, a 3D objective function is used to refine the placement result during HBT-cell co-optimization. Our placer achieves the best results for all contest test cases compared with the participating teams at the 2023 CAD Contest at ICCAD on 3D Placement with Macros.
Event(s)
61st ACM/IEEE Design Automation Conference, DAC 2024
Publisher
ACM
Type
conference paper