Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigration

Resource

Journal of Electronic Materials 35 (12): 2147-2153

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

12

Pages

2147-2153

Date Issued

2006

Date

2006

Author(s)

Lin, Y.L.

Lai, Y.S.

Tsai, C.M.

Kao, C.R.

URI

Type

journal article

File(s)

Name

04.pdf

Size

370.57 KB

Format

Adobe PDF

Checksum

(MD5):7d694abf71e4ca768223e048c0706a81