Electromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Pads

Resource

Journal of Electronic Materials 36 (7): 753-759

Journal

Journal of Electronic Materials

Journal Volume

36

Journal Issue

7

Pages

753-759

Date Issued

2007

Date

2007

Author(s)

Lin, W.H.

Wu, Albert T.

Lin, S.Z.

Chuang, T.H.

Tu, K.N.

URI

Type

journal article

File(s)

Name

107.pdf

Size

403.1 KB

Format

Adobe PDF

Checksum

(MD5):cfd7316d88fa5e600c7537cb5cadac4a