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  4. Multilevel full-chip routing with testability and yield enhancement.
 
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Multilevel full-chip routing with testability and yield enhancement.

Journal
The Seventh International Workshop on System-Level Interconnect Prediction (SLIP 2005), San Francisco, CA, USA, April 2-3, 2005, Proceedings
Pages
29-36
Date Issued
2005
Author(s)
Li, Katherine Shu-Min
Lee, Chung-Len
Chang, Yao-Wen
Su, Chauchin
Chen, Jwu E.
YAO-WEN CHANG  
DOI
10.1145/1053355.1053362
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/501959
URL
https://doi.org/10.1145/1053355.1053362
Abstract
We propose a multilevel full-chip routing algorithm that improves testability and diagnosability, manufacturability, and signal integrity for yield enhancement. Two major issues are addressed. (1) The oscillation ring (OR) test and its diagnosis scheme for interconnect based on the IEEE P1500 are integrated into the multilevel routing framework to achieve testability enhancement. (2) We present a heuristic to balance routing congestion to optimize the multiple-fault probability, chemical mechanic polishing (CMP) and optical proximity correction (OPC) induced manufacturability, and crosstalk effects, for yield improvement. Experimental results on the MCNC benchmark circuits show that the proposed OR method achieves 100% fault coverage and the maximal diagnosis resolution for interconnects, and the multilevel routing algorithm effectively balances the routing density to achieve 100% routing completion. Compared with [14], the experimental results show that our router improves the maximal congestion by 1.24X--6.11X in runtime speedup by 1.08X--7.66X, and improves the average congestion by 1.00X--4.52X with the improved congestion deviation by 1.37X--5.55X.
Type
conference paper

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