Development and Application of Gas-Assisted Transfer Stamping Technique
Date Issued
2009
Date
2009
Author(s)
Chen, Jian-Wei
Abstract
The thesis develops a micro transfer stamping technique to fabricate microstructures. There are five advantages of the micro transfer stamping technique: 1. This is a simple process; 2. There is no residual layer, therefore no additional process is needed to remove the residual layer; 3. The process can fabricate multi-layer structure; 4. The process is theoretically suitable for all solution-processable materials; 5. No additional chemical process is needed in the process.here are five research topics in this thesis, including fabrication of mold with flat bottom surface using lithography process, casting technique for fabricating PDMS mold, deformation simulation of PDMS mold in the transfer stamping process, development of single-/ multi- layer transfer stamping process, and application of the micro transfer stamping process.n the section of fabrication of mold with flat bottom surface using lithography process, for obtaining the mold with flat bottom surface, ICP, dry film resist and SU-8 were used to fabricate the master mold with microstructures, and compared advantages and disadvantages in this study. In the “deformation simulation of soft mold in the transfer stamping process” section, to verify the accuracy of Infinite Element simulation, we observed the real deformation of PDMS mold using optic microscopy. According to the simulation results, the “gap” between microstructures of PDMS mold sags as the applied pressure is high enough or the gap length is large. A large sagging distance would lead to residual layer appearance in the transfer stamping process. It was found that increasing PDMS mold thickness could prevent residual layer forming.n the section of development of single-/ multi-layer transfer stamping process, we proposed a method of controlling the surface energy to transfer stamping. PDMS mold was treated by oxygen plasma surface treatment to increase the surface energy for uniformly spin coating “ink” on PDMS mold. And then, with proper pressure, temperature, and heating the PDMS mold to restore surface energy for detaching, the ink (EPG510) could successfully be transferred on the PMMA substrate with no residual layer. The section also proves that the micro transfer stamping technique can transfer the ink (EPG510) on various substrate, such as PMMA, aluminum, PET, PC, silicon wafer and ITO. In the section of application of micro transfer stamping technique, we proved that the micro transfer stamping can successfully transfer PEDOT:PSS on PMMA. We also proved that the single-layer transferred PR patterns can replace lithography process, to be directly used as the etching mask or electroless nickel plating mask.
Subjects
stamping
printing
NIL
muti-layer
OTFT
Type
thesis
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