Publication:
Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finish

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Date

2002

Authors

Luo W.-C.
C. ROBERT KAO;Kao C.R.;Luo W.-C.
C. ROBERT KAO

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Institute of Electrical and Electronics Engineers Inc.

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https://www.scopus.com/inward/record.uri?eid=2-s2.0-84966667353&doi=10.1109%2fEMAP.2002.1188860&partnerID=40&md5=899c03274b9faad27195bb1b6fbc0ded
 https://scholars.lib.ntu.edu.tw/handle/123456789/432730

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Materials Science and Engineering / 材料科學與工程學系
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