The Analysis of the Heat Transfer and Thermal Stresses in Thermoelectric Cooler
Date Issued
2004
Date
2004
Author(s)
Chou, Po-Kuei
DOI
zh-TW
Abstract
The thermal stress is a critical issue to the success of a thin-film thermoelectric cooler. The main purpose of this thesis is to establish a simple 1-D model for a thermal stress analysis of a thin-film thermoelectric element. Numerical computations in use of the software ANSYS are also performed for a comparison. This study shows that 1-D results share similar trends to those observed from computations, but the stress magnitudes are smaller. The reason is because in 1-D analysis, the potential effect on the stresses of the Z-direction displacement is ignored. Moreover, junction stresses can not be correctly captured in the 1-D model.
Furthermore, Thomson effect is also taken into consideration while it is usually ignored in the literatures. Taking advantage of this effect, a better cooling ability can be attained, although also resulted are bigger thermal stresses. This 1-D model can thus offer a primary estimation for the design of novel thermoelectric cooler without deep consideration of junction stress.
Subjects
湯姆生效應
熱電致冷元件
熱應力
Thermoelectric cooler
thermal stress
Thomson effect
Type
thesis
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