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  4. Development of a low-melting-point filler metal for brazing aluminum alloys
 
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Development of a low-melting-point filler metal for brazing aluminum alloys

Resource
Metallurgical and Materials Transactions A 31 (9): 2239-2245
Journal
Metallurgical and Materials Transactions A
Journal Volume
31
Journal Issue
9
Pages
2239-2245
Date Issued
2000
Date
2000
Author(s)
Chuang, T. H.
Tsao, L. C.
Tsai, T. C.
Yeh, M. S.
Wu, C. S.
URI
http://ntur.lib.ntu.edu.tw//handle/246246/95913
https://www.scopus.com/inward/record.uri?eid=2-s2.0-0034266895&doi=10.1007%2fs11661-000-0141-z&partnerID=40&md5=0d8c044b8d1c2e35d53906e306909335
Abstract
The study is concerned with developing low-melting-point filler metals for brazing aluminum alloys. For this purpose, thermal analyzes of a series of Al-Si-Cu-Sn filler metals have been conducted and corresponding microstructures observed. The results showed that the liquidus temperature of Al-Si-Cu filler metals dropped from 593 °C to 534 °C, when the amount of copper was increased from 0 to 30 pct. As the copper content reached further to 40 pct, the liquidus temperature would rise to 572 °C. By adding 2 pct tin into the Al-Si-20Cu alloys, the liquidus and solidus temperature would fall from 543 °C to 526 °C and from 524 °C to 504 °C, respectively. The main microstructures of Al-Si-Cu alloys consist of the α-Al solid solution, silicon particles, the CuAl2 (θ) intermetallic, and the eutectic structures of Al-Si, Al-Cu, and Al-Si-Cu. For further improvement of the brazability of this filler metal, magnesium was added as a wetting agent, which would remove the residual oxygen and moisture from the brazed aluminum surface and reduce the oxide film. Based on results gleaned from the thermal analyzes, a new filler metal with the composition Al-7Si-20Cu-2Sn-1Mg is proposed, which possesses a melting temperature range of 501 °C to 522 °C and a microstructure that includes an Al-Si solid solution, silicon particles, a tin-rich phase, and CuAl2, CuMgAl2, and Mg2Si intermetallic compounds. When this filler metal was used to braze the 6061-T6 aluminum alloy, an optimized bonding strength of 196±19 MPa was achieved.
Other Subjects
Bonding; Brazing filler metals; Copper alloys; Intermetallics; Melting; Metallographic microstructure; Silicon alloys; Thermal effects; Thermoanalysis; Brazability; Aluminum alloys
Type
journal article
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