Vibration Induced Fatigue Reliability nalysis of BGA Packages
Date Issued
2008
Date
2008
Author(s)
Kong, Wei-Kuo
Abstract
It has been pointed out that vibration induced fatigue of solder balls is one of the major failure mechanisms of ball grid array (BGA) packages. Therefore, in the present paper, the life and reliability of a BGA package is studied in consideration of fatigue of its solder balls. Special attention is paid to the following issues. First, quantitative reliability in addition to qualitative reliability is studied. Secondly, to be compliant with the green packages requirement, fatigue life and reliability of solder balls made of Sn-Ag-Cu alloy (Pb-free) are compared with that made of Sn-Pb alloy. Thirdly, the influence of uncertainty/variation of solder ball geometry and/or material property on fatigue life and reliability estimation of the BGA is studied. The result shows that, under the same vibration condition, the BGA made of Pb-free solder balls has longer but more dispersive fatigue life than the one made of Pb solder balls. With regard to the uncertainty/variation of solder ball geometry and material property, it is found that interaction of both (geometry and material property) uncertainties results in more dispersive fatigue life than the case that only one uncertainty is considered.
Subjects
vibration
quantitative reliability
interaction
dispersive
Type
thesis
File(s)![Thumbnail Image]()
Loading...
Name
ntu-97-R95522524-1.pdf
Size
23.53 KB
Format
Adobe PDF
Checksum
(MD5):b8903e584971ba16d4e0b3e325cb1f7a