Interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films
Journal
Journal of Materials Engineering and Performance
Journal Volume
11
Journal Issue
5
Pages
481-486
Date Issued
2002
Author(s)
Abstract
The interfacial reactions of liquid Sn and Sn-3.5Ag solders with Ag thick films are investigated in the temperature range from 250-325°C, and the morphology of intermetallic compounds formed after such soldering reactions is observed. In kinetics analysis of the growths of intermetallic compounds, it was found that both Sn/Ag and Sn-3.5Ag/Ag reactions were interfacial-controlled, and the growth rates for both cases were similar. The rate of Ag dissolution into liquid solder attendant on the formation of interfacial intermetallic compounds after Sn/Ag reaction was about four times higher than that after Sn-3.5Ag/Ag reaction, as evidenced by experimental results.
Type
journal article