Efficient Thermal Analysis for Heat Dissipation in Three-Dimensional Chip-Stacking Packaging
Journal
2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Part Of
33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024
Start Page
1
End Page
3
ISBN (of the container)
979-835035123-1
Date Issued
2024-10-06
Author(s)
Event(s)
33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024
SDGs
Publisher
IEEE
Type
conference paper