Efficient Thermal Analysis for Heat Dissipation in Three-Dimensional Chip-Stacking Packaging
Journal
2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)
Part Of
33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024
Start Page
1
End Page
3
ISBN (of the container)
979-835035123-1
Date Issued
2024-10-06
Author(s)
Abstract
Advances in high-performance computing are driving thermal analysis for 3D chip-stacking packaging to assess its heat dissipation. Rather than the finite-element method, an efficient and accurate semi-analytic estimation method of temperature distribution is proposed.
Event(s)
33rd IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2024
SDGs
Publisher
IEEE
Type
conference paper