High performance Ag-Pd alloy wires for high frequency IC packages

Journal

Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT

Pages

162-165

Date Issued

2013

Author(s)

Tsai, H.-H.

Chuang, T.-H.

Lee, J.-D.

Tsai, C.-H.

Wang, H.-C.

Lin, H.-J.

Chang, C.-C.

DOI

URI

URL

Type

conference paper