The Collodial Quantum Dots Light-Emitting Diodes Device Integrated with a Solder-Ball
Journal
2021 IEEE Photonics Conference, IPC 2021 - Proceedings
Date Issued
2021
Author(s)
Abstract
The Sn-ball integrated with the QDLED package are designed to achieve more effective heat dissipation. The thermal, luminescence and aging tests of this structure were evaluated and was proved that have good CCE and reliability. ? 2021 IEEE.
Subjects
LED
Package
Quantum dot
Nanocrystals
Semiconductor quantum dots
Soldering
Testing
Ageing tests
Quantum-dot light emitting diodes
Solder balls
Thermal tests
Organic light emitting diodes (OLED)
SDGs
Type
conference paper