Antenna-in-Packages for Array Modularization at Millimeter-wave Frequencies and its Applications in 5G O-RAN
Journal
2021 International Symposium on Antennas and Propagation, ISAP 2021
Date Issued
2021
Author(s)
Abstract
In this paper, the design issues of antenna-in-package (AiP) is discussed to modularize arrays at millimeter-wave (mmW) frequencies for 5G applications. The current progress of AiP technologies at NTU is also summarized. The issues of considerations include different fabrication process, dielectric property deviation and mechanical limitations to realize the antenna structure. Antenna designs for various applications, ranging from user equipment, CPE to small cell BTS antennas, have been developed at different sizes. The radiation characteristics of these AiPs will be presented to demonstrate the behaviors of AiPs using these processes. Both full-wave simulations and experimental measurements will be presented to validate the AiP designs. ? 2021 Taiwan Microwave Association.
Subjects
Antenna array
antennas-in-package
design considerations
dielectric substrates
LTCC
millimeter-wave frequencies
SiP
5G mobile communication systems
Antenna arrays
Dielectric properties
Directional patterns (antenna)
Millimeter waves
Modular construction
Silicon compounds
'current
Antenna in packages
Design considerations
Design issues
Dielectric substrates
Frequency applications
ITS applications
Millimeter wave frequencies
Modularizations
System-in-package
SDGs
Type
conference paper