小型熱聲冷凍機製造及研究(1/3)
Date Issued
2003-07-31
Date
2003-07-31
Author(s)
DOI
912212E002098
Abstract
This three-year proposal aims at design,
fabrication and experimental study of small
cooling devices. The term ‘small cooling
devices’implies cooling systems whose overall
length-scale ranges from centimeter (first year
focus) to millimeter (second year focus), but
with MEMS fabricated components throughout
the course of the three-year project (as an
example, see Fig. 8). The first year will focus
on the stack, perhaps the key component in a
thermoacoustic device, and its performance.
The second year will focus on the driver
(micro-speaker) and its performance. The focus
of the third year would be to integrate results
from the first two years.
The first year focus is on the design and
testing of a new small-scale thermoacoustics
refrigerator stack using micro-machined
technique. The unique approach is to use
several MEMS fabricated silicon wafers with
equally spaced gap as the stack. The motivation
is based on the physic of suppressing
conduction heat transfer (due to the air gap) in
the direction of acoustic oscillation while
encouraging heat transfer in the normal
direction, since thermal conductivity of silicon
(150W/m-K) is much higher than that of air
(0.025W/m-K). The stack assembly will be
mounted adjacent to an oscillating piston (max
300 Hz) as an acoustic source. Results will be
compared with a ceramic stack as baseline as
well as computation by a linear acoustic code
DeltaE.
Publisher
臺北市：國立臺灣大學應用力學研究所
Type
report
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