Improved resistive switching phenomena and mechanism using Cu-Al alloy in a new Cu:AlOx/TaOx/TiN structure

Journal

Journal of Alloys and Compounds

Journal Volume

637

Pages

517-523

Date Issued

2015

Author(s)

Roy, S.

Maikap, S.

Sreekanth, G.

Dutta, M.

Jana, D.

Chen, Y.Y.

Yang, J.R.

DOI

10.1016/j.jallcom.2015.02.168

URI

https://scholars.lib.ntu.edu.tw/handle/123456789/491539

URL

https://www.scopus.com/inward/record.uri?eid=2-s2.0-84925279972&doi=10.1016%2fj.jallcom.2015.02.168&partnerID=40&md5=40e76948b4c974b9175ff48e9eaad86d

Type

journal article