The Inhibition of Tin Whiskers on the Surface of Sn-8Zn-3Bi-0.5Ce Solders
Resource
Journal of Materials Engineering and Performance, 20(6), 1043-1048
Journal
Journal of Materials Engineering and Performance
Pages
1043-1048
Date Issued
2011
Date
2011
Author(s)
Abstract
Through the refinement of the (Ce, Zn)Sn 3 intermetallic phase, the formation of tin whiskers, previously observed on the surface of a Sn-3Ag-0.5Cu-0.5Ce solder, was prevented in a Sn-9Zn-0.5Ce alloy. However, whisker growth can still occur on the surface of Sn-8Zn-3Bi-0.5Ce solder after air storage at room temperature and at 150°C due to the formation of large (Ce, Zn)Sn 3 intermetallic clusters. Further experiments showed that decreasing the Bi-content in this Sn-8Zn-0.5Ce alloy to 1 and 2 wt.% can recover the beneficial effects of Zn additions on the refinement of the (Ce, Zn)Sn 3 phase and obviously reduce the appearance of tin whiskers. In addition, alloying the Sn-8Zn-3Bi-0.5Ce solder with 0.5 wt.% Ge, which increases the oxidation resistance of the (Ce, Zn)Sn 3 intermetallic clusters, can also effectively inhibit tin whisker growth. © ASM International.
Type
journal article
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