固液擴散接合法製作電子構裝耐溫微接點研究(Ⅲ)─總計畫
Date Issued
2000
Date
2000
Author(s)
DOI
892216E002028
Abstract
The research in this project focused on the
increasing thermal resistance demand of
interconnectors in high density electronic
packages. For this purpose, a novel technique
²solid-liquid interdiffusion bonding (SLID)²
was developed.
The efforts of this group project were
focused on interfacial reactions during the
the SLID process, and analysis of the
interfacial microstructure, micro-chemistry
and mechanical properties of the joint after
SLID. Parallel with the bonding studies, the
relevant intermetallic compounds formed
during the SLID process have been prepared
externally with reference to their phase
diagrams. The mechanical, electrical,
magnetic and corrosion properties of these
monolithic intermetallic compounds were
analyzed.
Subjects
Interfacial Reactions
Interfacial Microstructure
Monolithic Intermetallic
Compounds
Compounds
Publisher
臺北市：國立臺灣大學材料科學與工程學研究所
Type
report
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892216E002028.pdf
Size
1.13 MB
Format
Adobe PDF
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(MD5):4d3300945acbef9c98bdef4e9be4d96f