5nm ruthenium thin film as a directly plateable copper diffusion barrier

Journal

Applied Physics Letters

Journal Volume

86

Journal Issue

8

Pages

083104-1 - 083104-3

Date Issued

2005

Author(s)

T. N. Arunagiri

Y. Zhang

O. Chyan

M. El-Bounani

M. J. Kim

C. T. Wu

K. H. Chen

DOI

URI

Publisher

American Institute of Physics

Type

journal article