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College of Electrical Engineering and Computer Science / 電機資訊學院
Electronics Engineering / 電子工程學研究所
A 3.5-GHz SiGe 0.35μm HBT flip-chip assembled on ceramics integrated passive device Doherty power amplifier for SiP integration
Details
A 3.5-GHz SiGe 0.35μm HBT flip-chip assembled on ceramics integrated passive device Doherty power amplifier for SiP integration
Journal
Asia-Pacific Microwave Conference
Pages
114-117
Date Issued
2011
Author(s)
Kuo, C.-C.
Lin, P.-A.
Kuo, J.-L.
Lu, H.-C.
Hsin, Y.-M.
Wang, H.
HSIN-CHIA LU
URI
http://www.scopus.com/inward/record.url?eid=2-s2.0-84860523539&partnerID=MN8TOARS
http://scholars.lib.ntu.edu.tw/handle/123456789/362973
Type
conference paper