K band PCB-to-LTCC BGA transition compensation and V band LTCC-to-LTCC flip-chip transition design
Date Issued
2014
Date
2014
Author(s)
Lin, Chia-Hsien
Abstract
This thesis is divided into two parts: firstly, it is about BGA (ball grid array) transition compensation design with hi-low impedance. The connections between PCB and LTCC (low temperature co-fired ceramic) substrate are made by reflow of solder balls. Microstrip line is used in this transition. and can be better than -20dB at 19GHz +/- 1GHz and 29GHz +/- 1GHz. Secondly, we will design the flip-chip transition in multi-layer substrate using quasi-coaxial line as a vertical inner transition. New quasi-coaxial type bumps replace traditional GSG flip-chip bumps are used in the range from 40GHz to 70GHz. It could reach better than 10dB in return loss and be a broadband flip-chip transition.
Subjects
覆晶技術
多層介質轉接
準同軸線架構
垂直轉接
錫球網格陣列
Type
thesis
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