A New Model for Through-Silicon Vias on 3-D IC Using Conformal Mapping Method

Journal

IEEE Microwave and Wireless Components Letters

Journal Volume

22

Journal Issue

6

Pages

303 - 305

Date Issued

2012-06

Author(s)

T.-Y. Cheng

C.-D. Wang

Y.-P. Chiou

DOI

10.1109/LMWC.2012.2195776

URI

http://scholars.lib.ntu.edu.tw/handle/123456789/374149

Type

journal article