Compact modeling and simulation of TSV with experimental verification
Journal
2016 International Symposium on VLSI Technology, Systems and Application, VLSI-TSA 2016
Date Issued
2016
Author(s)
Yan, J.-Y.
Jan, S.-R.
Huang, Y.-C.
Lan, H.-S.
Liu, C.W.
Huang, Y.-H.
Hung, B.
Chan, K.-T.
Huang, M.
Yang, M.-T.
Type
conference paper