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College of Electrical Engineering and Computer Science / 電機資訊學院
Electrical Engineering / 電機工程學系
Nonlinear analytic model for the strain field induced by thermal copper filled TSVs
Details
Nonlinear analytic model for the strain field induced by thermal copper filled TSVs
Journal
e-Manufacturing & Design Collaboration Symposium
Date Issued
2013
Author(s)
M. H.Liao
C.-H. Chen
J.-J. Lee
K.-C. Chen
J.-H. Liang
URI
https://scholars.lib.ntu.edu.tw/handle/123456789/404536
Type
conference proceedings
