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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
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Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes
Resource
Journal of Electronic Materials 35 (2): 302-309
Journal
Journal of Electronic Materials
Journal Volume
35
Journal Issue
2
Pages
302-309
Date Issued
2006
Date
2006
Author(s)
Chuang, T. H.
Yen, S. F.
Cheng, M. D.
URI
http://ntur.lib.ntu.edu.tw//handle/246246/95954
Type
journal article
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Name
96.pdf
Size
648.78 KB
Format
Adobe PDF
Checksum
(MD5):cc7bcbe7706cf1c462185c13c521c49e
