Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes

Resource

Journal of Electronic Materials 35 (2): 302-309

Journal

Journal of Electronic Materials

Journal Volume

35

Journal Issue

2

Pages

302-309

Date Issued

2006

Date

2006

Author(s)

Chuang, T. H.

Yen, S. F.

Cheng, M. D.

URI

Type

journal article

File(s)

Name

96.pdf

Size

648.78 KB

Format

Adobe PDF

Checksum

(MD5):cc7bcbe7706cf1c462185c13c521c49e