Model Extraction and Analysis of Bonding Wires and Package Pins
Date Issued
2005
Date
2005
Author(s)
Lin, Hao-Geng
DOI
zh-TW
Abstract
Recently, many contributions have been made in the full-wave analysis of package and interconnect discontinuities. Most of these contributions presented analysis of one aspect of package or one bonding wire, but very few account for multiple interacting structures of a complete package or electronic system. In addition, when the applied signal is trending to the high frequency region, electromagnetic interactions between all the bonding wires can cause the serious effects at high frequencies. The discontinuity induced by the bonding wires can significantly limit the high-frequency performance of the whole circuit and must be taken into account in the early stage of packaging designs.
The exploration of extracting the model of a single bonding wire and two bond ing wires while parallel coupling and perpendicular coupling is investigated in the thesis. A method is presented to extract the equivalent circuit of bonding wires and package pin in the thesis. The Ansoft High Frequency Structure Simulator (HFSS), using the finite element method (FEM), is employed to obtain the full-wave electrical characteristics of bonding wires in the high frequency. So be the equivalent circuit model of packaging pins obtained by Q3D. Therefore, the equivalent circuit models of bonding wires and packaging pins could be established quickly.
Furthermore, the inductance and capacitance values of equivalent circuit models are obtained by scaling the dimension of bonding wires. Accordingly, the lookup database of equivalent circuit’ model verse the geometrical setting of bonding wire is presented for packaging designers.
Subjects
封裝
構裝接線
晶片
互連結構
packaging
Bonding wire
die
interconnection
Type
thesis
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