The effect of NBTI on 3D integrated circuits

Journal

Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2012 IEEE

Pages

201 - 204

Date Issued

2012-12

Author(s)

Cheng-Hong Lin

Yi-Chang Lu

Chin-Khai Tang

Kuen-Yu Tsai

DOI

10.1109/EDAPS.2012.6469435

URI

http://scholars.lib.ntu.edu.tw/handle/123456789/374087

SDGs

[SDGs]SDG11

Type

conference paper