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College of Engineering / 工學院
Materials Science and Engineering / 材料科學與工程學系
Effect of Zn addition on the interfacial reactions between Cu and lead-free solders
Details
Effect of Zn addition on the interfacial reactions between Cu and lead-free solders
Journal
Materials Research Society Symposium
Journal Volume
968
Pages
81-87
ISBN
1558999256
9781558999251
Date Issued
2007
Author(s)
Yang S.-C.
Ho C.-E.
Chang C.-W.
C. ROBERT KAO
URI
https://www.scopus.com/inward/record.uri?eid=2-s2.0-34250808454&partnerID=40&md5=d664a970779d380d26458c09d6c9010e
https://scholars.lib.ntu.edu.tw/handle/123456789/432696
Type
conference paper