Thermal SPICE Modeling of FinFET and BEOL Considering Frequency-Dependent Transient Response, 3-D Heat Flow, Boundary/Alloy Scattering, and Interfacial Thermal Resistance
Journal
IEEE Transactions on Electron Devices
Journal Volume
66
Journal Issue
6
Pages
2710-2714
Date Issued
2019
Author(s)
Type
journal article