Publication: Implementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3D chip integration
| cris.lastimport.scopus | 2025-05-06T22:13:45Z | |
| cris.virtual.department | Applied Mathematical Sciences | en_US |
| cris.virtual.department | Center for Artificial Intelligence and Advanced Robotics | en_US |
| cris.virtual.orcid | 0000-0002-6154-7750 | en_US |
| cris.virtualsource.department | e9e898d0-27af-4c8f-89b5-11be55210e6a | |
| cris.virtualsource.department | e9e898d0-27af-4c8f-89b5-11be55210e6a | |
| cris.virtualsource.orcid | e9e898d0-27af-4c8f-89b5-11be55210e6a | |
| dc.contributor.author | Lin, Chiung-Wen | en_US |
| dc.contributor.author | Hsu, Chia-Pao | en_US |
| dc.contributor.author | Yang, Hsueh-An | en_US |
| dc.contributor.author | Wang, Wei Chung | en_US |
| dc.contributor.author | WEICHUNG WANG | en_US |
| dc.creator | Lin, Chiung-Wen;Hsu, Chia-Pao;Yang, Hsueh-An;Wang, Wei Chung;Fang, Weileun | |
| dc.date.accessioned | 2019-10-28T03:21:27Z | |
| dc.date.available | 2019-10-28T03:21:27Z | |
| dc.date.issued | 2008 | |
| dc.identifier.doi | 10.1088/0960-1317/18/2/025018 | |
| dc.identifier.isi | WOS:000252966100018 | |
| dc.identifier.issn | 0960-1317 | |
| dc.identifier.uri | https://scholars.lib.ntu.edu.tw/handle/123456789/428600 | |
| dc.relation.ispartof | Journal of Micromechanics and Microengineering | |
| dc.relation.journalissue | 2 | |
| dc.relation.journalvolume | 18 | |
| dc.relation.pages | 25018 | |
| dc.title | Implementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3D chip integration | |
| dc.type | journal article | en |
| dspace.entity.type | Publication |