Thermal properties of high refractive index epoxy resin system
Resource
Thermochimica Acta 392-393C: 385-389
Journal
Thermochimica Acta
Journal Volume
392-393
Pages
385-389
Date Issued
2002
Author(s)
Abstract
The goal of our study is to develop high refractive index (&1.60) epoxy resin system for optoelectronics and electro-optical equipment assemblies. Molecular design approach is applied to reach this goal by implement of rigid rod moeities or heavy elements (Br) into the epoxy structures. The thermal properties of these new epoxy resins were studied by modulated differential scanning calorimetry (MDSC) and thermogravimetric analyzer (TGA) to investigate the effects of changes of chemical structures. The epoxy resin system containing rigid rod structure exhibits better thermal properties than those containing flexible structure. © 2002 Elsevier Science B.V. All rights reserved.
Type
journal article
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